Qualcomm, SMIC Sign Foundry Agreement
July 28, 2006
Qualcomm announced on July 27 that it has signed an agreement with Chinese SMIC (Semiconductor Manufacturing International Corp.) for manufacturing and testing services. Under the agreement, SMIC will start making Qualcomm's 3G mobile-phone chips and power-management ICs utilizing a specialized BiCMOS process technology at its 200mm wafer facility in Tianjin, China.